New Book on Life Cycle Assessment of Semiconductors

Dr. Sarah Boyd, Senior Consultant at PE INTERNATIONAL, has published a new book: Life-Cycle Assessment of Semiconductors. 

According to Dr. Boyd, the purpose of the book is to quantify and describe the environmental impacts of semiconductor manufacturing for Life Cycle Assessment (LCA) practitioners and students.

 

Small size but sold at large scale worldwide

Arpad Horvath, Professor at UC Berkeley, states: "Very rare is an LCA book that is able to tackle so many products with such detail and over several technological generations, while not losing sight of the economic perspective and geographic specificity of the semiconductor industry, and focusing not just on manufacturing and transportation, but also on the use phase of a product.  As well, this may be the first book written for a product of such small size but sold at such large scale worldwide like a typical semiconductor device."

 

First Life Cycle Assessment of semiconductor devices

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT).

 

Highly relevant and useful information

The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes but is not limited to semiconductor manufacturing trends by product type and geography, unique coverage of life-cycle assessment, with a focus on uncertainty and sensitivity analysis of energy and global warming missions for CMOS logic devices, life cycle assessment of flash memory and life cycle assessment of DRAM. The information and conclusions discussed here will be highly relevant and useful to individuals and institutions.

Dr. Boyd’s book is available through the publisher, Springer Press and on Amazon.com.